Light guide body aggregate substrate and production method for integrated light-emitting device

ABSTRACT

A light guide body aggregate substrate includes: a light-transmitting substrate having a main surface; a plurality of unit regions located at the main surface of the substrate, wherein the plurality of unit regions are spaced apart from each other, wherein the plurality of unit regions are arranged one-dimensionally in one row extending in a first direction and a plurality of columns, or arranged two-dimensionally in a plurality of rows extending in the first direction and a plurality of columns extending in a second direction, and wherein a light guide structure is located in each unit region; a first region located at the main surface of the substrate, surrounding the plurality of unit regions; and a 1-A alignment mark and a 1-B alignment mark arranged at the substrate in the first region.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 16/855,064, filed on Apr. 22, 2020, which claims priority toJapanese Patent Application No. 2019-085406, filed on Apr. 26, 2019, thedisclosures of which are hereby incorporated by reference in theirentireties.

BACKGROUND

The present disclosure relates to light guide body aggregate substratesand production methods for integrated light-emitting devices.

A light-emitting device including light-emitting elements such aslight-emitting diodes is widely used as a backlight for a display suchas a liquid crystal display apparatus. In particular, a direct-litbacklight is employed in order to increase the luminance of a display,or increase the contrast of an image by performing partial drive.

In some recent applications, the thickness of a display equipped with adirect-lit backlight is required to be reduced to the extent possible.Therefore, the thickness of the direct-lit backlight may also berequired to be reduced to the extent possible. For example, JapanesePatent Publication No. 2018-133304 discloses an integratedlight-emitting device in which lenses for diffusing light are providedon a light guide plate, and light-emitting elements are joined to thelight guide plate. Such a configuration can provide a thinner integratedlight-emitting device.

SUMMARY

In some cases, in such an integrated light-emitting device in whichlight-emitting elements are joined to a light guide plate, the influenceof expansion of the light guide plate due to a thermal treatment in theproduction process is required to be reduced. The present disclosureprovides an integrated light-emitting device in which the influence ofexpansion of the light guide plate due to a thermal treatment in theproduction process is reduced, and a production method therefor.

A light guide body aggregate substrate according to an embodiment of thepresent disclosure includes: a light-transmitting substrate having amain surface; a plurality of unit regions disposed on the main surfaceof the substrate, arranged onedimensionally in one row extending in afirst direction and a plurality of columns, or arrangedtwo-dimensionally in a plurality of rows extending in the firstdirection and a plurality of columns extending in a second direction,and spaced apart from each other, each unit region having a light guidestructure; a marginal region located on the main surface of thesubstrate, surrounding each of the plurality of unit regions; and aplurality of first alignment marks arranged in the first direction onthe substrate in the marginal region, each first alignment mark beingdisposed at a position corresponding to a position in the firstdirection of a corresponding one of the plurality of columns of theplurality of unit regions extending in the second direction.

A method for producing an integrated light-emitting device according toan embodiment of the present disclosure includes: preparing the abovelight guide body aggregate substrate; disposing a plurality of lightsources (a plurality of groups of light-emitting elements),corresponding to the plurality of unit regions, each light sourceincluding one or more light-emitting elements, and each light sourcebeing disposed for a corresponding one of the plurality of unit regionsso that light emitted from the one or more light-emitting elementsenters the light guide structure; and cutting the substrate in thesecond direction, with reference to a position of each of the pluralityof first alignment marks, in the marginal region between a correspondingpair of adjacent ones of the plurality of columns of the plurality ofunit regions.

According to certain embodiments of the present disclosure, anintegrated light-emitting device is obtained in which the influence ofexpansion of a light guide plate due to a thermal treatment in aproduction process is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram for describing how the position of aregion 510 of a light guide body aggregate substrate in which anintegrated light-emitting device is to be formed deviates due to athermal treatment.

FIG. 1B is a schematic diagram showing the position of a region 510′ ina piece that is close to the origin in the case in which a light guidebody aggregate substrate that has expanded is cut into pieces.

FIG. 1C is a schematic diagram showing the position of a region 510′ ina piece that is far from the origin in the case in which a light guidebody aggregate substrate that has expanded is cut into pieces.

FIG. 2 is a perspective view showing an example integratedlight-emitting device.

FIG. 3 is a cross-sectional view and top view of one light-emittingmodule included in an integrated light-emitting device.

FIG. 4A is a top view showing an example light guide body aggregatesubstrate.

FIG. 4B is a bottom view showing an example light guide body aggregatesubstrate.

FIG. 4C is a cross-sectional view showing an example light guide bodyaggregate substrate.

FIG. 5 is a flowchart showing an example production method for anintegrated light-emitting device.

FIG. 6 is a top view showing positions where an light guide bodyaggregate substrate 301 is cut in a production method for an integratedlight-emitting device.

FIG. 7 is a top view showing another example light guide body aggregatesubstrate.

FIG. 8 is a top view showing another example light guide body aggregatesubstrate.

FIG. 9 is a top view showing another example light guide body aggregatesubstrate.

FIG. 10A is a top view showing another example light guide bodyaggregate substrate.

FIG. 10B is a bottom view showing another example light guide bodyaggregate substrate.

FIG. 10C is a cross-sectional view showing another example light guidebody aggregate substrate.

DETAILED DESCRIPTION

When an integrated light-emitting device in which light-emittingelements are joined to a light guide plate (such as that disclosed inJapanese Patent Publication No. 2018-133304) is used as a direct-litbacklight for a display, a single such integrated light-emitting devicethat has a size corresponding to the screen of the display may be used,for example. In that case, it is necessary to arrange and join a largenumber of light-emitting elements on a single light guide plate having asize corresponding to the screen. Therefore, for example, even if justone of the light-emitting elements on the single light guide plate doesnot properly work or is not disposed at an appropriate position, theintegrated light-emitting device as a whole may be defective, and themanufacturing yield may be reduced.

In order to circumvent such a reduction in the manufacturing yield, thescreen of a display may be divided into a plurality of regions, aplurality of integrated light-emitting devices each having a sizecorresponding to the region may be produced, and the plurality ofintegrated light-emitting device may be disposed. For example,initially, a plurality of light-emitting elements are arranged andjoined on a light guide plate with a side several centimeters long, toproduce a small integrated light-emitting device. Thereafter, aplurality of such small integrated light-emitting devices aretwo-dimensionally disposed. The resultant structure as a whole can beused as a backlight suitable for a large screen.

The number of light-emitting elements joined to such a small integratedlight-emitting device is smaller than when light-emitting elements arearranged and joined on a light guide plate having a size correspondingto the entire screen, and therefore, the small integrated light-emittingdevice can be manufactured at a higher yield. In addition, variousdisplays having different screen sizes can be produced using differentnumbers of small integrated light-emitting devices disposed, and can bemanufactured at lower cost than when integrated light-emitting deviceshaving light guide plates having different sizes corresponding todifferent screen sizes are prepared.

In the case of production of a small integrated light-emitting device, aplurality of small integrated light-emitting devices are preferablyproduced in the same process in order to improve manufacturingefficiency and reduce manufacturing cost. Specifically, an aggregate ofa plurality of small integrated light-emitting devices is produced usinga single aggregate substrate, and thereafter, the aggregate substrate iscut into pieces, i.e., diced, to produce a plurality of small integratedlight-emitting devices. According to this method, even if there is onedefective light-emitting element in the aggregate of small integratedlight-emitting devices, only one of the small integrated light-emittingdevices that includes that defective light-emitting element isdefective. Therefore, the manufacturing yield can be maintained highcompared to when a single integrated light-emitting device having a sizecorresponding to the screen size is produced as described above.

However, when producing small integrated light-emitting devices usingsuch a production method, the aggregate substrate is exposed to heat inthe production process when the light-emitting elements are joined tothe aggregate substrate and when a reflective member is formed, so thatthe aggregate substrate expands or contracts. As a result, a positionwhere the aggregate substrate is cut deviates. For example, as shown inFIG. 1A, it is assumed that regions 510, in each of which an integratedlight-emitting device is to be formed, are disposed in four rows andfive columns on a light guide body aggregate substrate (or light guideplate aggregate substrate) 500. When light-emitting elements are joinedor a reflective member is formed on the light guide body aggregatesubstrate 500, the light guide body aggregate substrate 500 is subjectedto a thermal treatment, so that the light guide body aggregate substrate500 expands to become a light guide body aggregate substrate 500′.Regions 510′, in each of which an integrated light-emitting device isformed on the light guide body aggregate substrate 500′, move due toexpansion of the light guide body aggregate substrate 500′.

As shown in FIG. 1A, an X axis and a Y axis are provided, and one of thefour vertices of each of the light guide body aggregate substrates 500and 500′ is disposed at the origin of the coordinate system. As shown inFIG. 1A, the deviation of the position of a region 510′ on the lightguide body aggregate substrate 500′ from the position of thecorresponding region 510 on the light guide body aggregate substrate 500becomes gradually more significant as the distance from the originincreases. Therefore, when the light guide body aggregate substrate 500′is cut into pieces, i.e., the individual regions 510′, at the pitch ofthe regions 510 on the light guide body aggregate substrate 500 (i.e.,at positions indicated by dash-dot lines in FIG. 1A), the region 510′ ofthe light guide body aggregate substrate 500′ closest to the origin isdisposed at the center of the piece almost exactly as designed as shownFIG. 1B, and the region 510′ of the light guide body aggregate substrate500′ furthest from the origin significantly deviates from the center ofthe piece as shown in FIG. 1C.

With the above problem in mind, the present inventor has conceived of anovel light guide body aggregate substrate and production method for anintegrated light-emitting device. Embodiments of the present disclosurewill now be described with reference to the accompanying drawings. Thefollowing embodiments are illustrative, and the light guide bodyaggregate substrate and production method for an integratedlight-emitting device of the present disclosure are not limited thereto.For example, the numerical values, shapes, materials, steps, and theorder of the steps, etc., indicated in the following embodiments aremerely illustrative, and various modifications can be made theretounless a technical contradiction occurs. The embodiments below aremerely illustrative and can be used in various combinations unless atechnical contradiction occurs.

The dimensions, shapes, etc., of elements shown in the drawings may beexaggerated for clarity. The dimensions, shapes, etc., of the elementsof the light-emitting module are not necessarily drawn to scale, e.g.,the dimensions of some of the elements of the light-emitting modulerelative to the other elements may be exaggerated. Some of the elementsmay not be shown, in order to avoid unnecessarily obfuscating thedrawings.

In the description that follows, elements of like functions may bedenoted by like reference signs and may not be described redundantly.Terms indicating specific directions and positions (e.g., “upper,”“lower,” “right,” “left,” and other terms including such terms) may behereinafter used. Note however that these terms are only used forclarity of illustration to refer to relative directions and positions inthe drawings to which reference is made. When applied to drawings,actual products, actual manufacturing apparatuses, etc., other thanthose of the present disclosure, the elements need not have the samearrangement as that shown in the drawings to which reference is made, aslong as the elements have the same directions and positions relative toeach other that are indicated by the terms such as “upper” and “lower”in the drawings to which reference is made. As used herein, the term“parallel” with respect to two straight lines, sides, planes, etc., isintended to encompass some deviations from absolute parallelism (0°)that are in the range of about ±5° unless otherwise specified. As usedherein, the term “perpendicular” or “orthogonal” with respect to twostraight lines, sides, planes, etc., is intended to encompass somedeviations from absolute perpendicularity or orthogonality (90°) thatare in the range of about ±5° unless otherwise specified.

(Structure of Integrated Light-Emitting Device)

Firstly, an integrated light-emitting device that is produced using alight guide body aggregate substrate according to the present disclosurewill be described. FIG. 2 shows an illustrative configuration of anintegrated light-emitting device according to an embodiment of thepresent disclosure. The integrated light-emitting device 200 of FIG. 2includes a light guide body 210 having an upper surface 210 a, and alayer-shaped light reflective layer 240 located on a lower surface 210 bof the light guide body 210. Note that FIG. 2 additionally shows arrowsindicating an X direction, Y direction, and Z direction that areorthogonal to each other for the sake of convenience. In some of theother figures of the present disclosure, arrows indicating thesedirections are also shown. The X and Y directions are also a first and asecond direction.

The integrated light-emitting device 200 is in the shape of a plate as awhole. The light guide body 210 has a light guide structure in whichlight emitted from a plurality of light-emitting elements disposed onthe lower surface 210 b is emitted from the upper surface 210 a. Theupper surface 210 a is a light emission surface of the integratedlight-emitting device 200. The upper surface 210 a of the light guidebody 210 typically has a rectangular shape. Here, the X and Y directionscoincide with one and the other, respectively, of the orthogonal sidesof the rectangular shape of the light guide body 210. The lengths of thesides of the rectangular shape of the upper surface 210 a are in therange of, for example, 1-200 cm. In a typical embodiment of the presentdisclosure, the lengths of the sides of the rectangular shape of theupper surface 210 a of the light guide body 210 are 10-30 mm. Thelengths in the lengthwise and widthwise directions of the upper surface210 a may be, for example, about 24.3 mm and 21.5 mm, respectively.

In the configuration illustrated in FIG. 2, the integratedlight-emitting device 200 includes an aggregate of light-emittingmodules 100 each including at least one light-emitting element. In thisexample, as schematically shown in FIG. 2, the integrated light-emittingdevice 200 includes a total of 16 light-emitting modules 100 arrangedtwo-dimensionally. Here, the 16 light-emitting modules 100 are arrangedin a matrix of four rows and four columns. The number and arrangement ofthe light-emitting modules 100 included in the integrated light-emittingdevice 200 are not particularly limited, and are not limited to theexample of FIG. 2.

As shown in FIG. 2, each light-emitting module 100 has a first hole 10that has, as a part thereof, an opening located on the upper surface 210a of the light guide body 210. As specifically described below, thelight-emitting element of each light-emitting module 100 is disposedsubstantially directly below the first hole 10. In this example, thelight-emitting elements are arranged in a matrix of four rows and fourcolumns extending in the X and Y directions, corresponding to thearrangement of the light-emitting modules 100 in a matrix of four rowsand four columns. The arrangement pitch of the light-emitting elementsmay be, for example, about 0.05-20 mm, and may be in the range of about1-10 mm. As used herein, the arrangement pitch of the light-emittingelements refers to the distance between the optical axes of thesuccessive light-emitting elements. The light-emitting elements arespaced either equally or unequally. The arrangement pitches in twodifferent directions of the light-emitting elements may be either thesame or different.

FIG. 3 shows the light-emitting module 100. FIG. 3 schematically shows across-section of the light-emitting module 100 taken perpendicular tothe upper surface 210 a of the light guide body 210 at or near thecenter of the light-emitting module 100, and an illustrative appearanceof the light-emitting module 100 as viewed from the upper surface 210 aof the light guide body 210 in a direction perpendicular to the uppersurface 210 a.

The light-emitting module 100 includes: a light guide body 110 having anupper surface 110 a in which the first hole 10 is provided, and a lowersurface 110 b located on the opposite side from the upper surface 110 a;a light source 160 including a light-emitting element 120; and areflective resin layer 130 located in the first hole 10. The light guidebody 110 is a part of the light guide body 210 shown in FIG. 2, and thefirst hole 10 of the light guide body 110 is one of the plurality offirst holes 10 shown in FIG. 2. Note that the light guide body 110 maybe formed of a single light guide plate continuous between two adjacentlight-emitting modules 100 in the integrated light-emitting device 200.Note that, for example, each light-emitting module 100 may have aseparate light guide body 110, and a clear boundary may be observedbetween the light guide bodies 110 of two light-emitting modules 100 inthe integrated light-emitting device 200.

In the configuration illustrated in FIG. 3, the light-emitting module100 further has a light reflective member 140 located on the lowersurface 110 b of the light guide body 110. The light reflective member140 is a part of the light reflective layer 240 shown in FIG. 2. In thisexample, the light reflective member 140 includes a layer-shaped baseportion 140 n, and a wall portion 140 w raised from the lower surface110 b of the light guide body 110 toward the upper surface 110 a. Anoutermost rectangle B of the dashed-line rectangles shown in a lowerportion of FIG. 2 indicates an inner periphery of the wall portion 140w. Although the inner periphery of the wall portion 140 w here has arectangular shape as an example, the inner periphery of the wall portion140 w may have other shapes, such as circular and elliptical. As withthe light guide body 110, the light reflective member 140 may be formedcontinuously across two adjacent light-emitting modules 100 in theintegrated light-emitting device 200.

The first hole 10 of the light guide body 110 is formed at or near thecenter of the upper surface 110 a. Here, the first hole 10 has a firstportion 11 having a first side surface 11 c sloped with respect to theupper surface 110 a, and a second portion 12 having a second sidesurface 12 c sloped with respect to the upper surface 110 a. As shown inFIG. 3, the second side surface 12 c of the second portion 12 is aportion of one or more side surfaces defining the shape of the firsthole 10 that is located between an opening 12 a located on the uppersurface 110 a of the light guide body 110 and the first side surface 11c of the first portion 11. The magnitude of the slope of the first sidesurface 11 c with respect to the upper surface 110 a is different fromthe magnitude of the slope of the second side surface 12 c with respectto the upper surface 110 a. In this example, the first portion 11 of thefirst hole 10 has a generally inverted conical shape, and the secondportion 12 of the first hole 10 has an inverted truncated conical shape.The first hole 10 functions as a lens that controls the direction inwhich light is emitted, by utilizing the refraction of light at theboundary between the inner surface of the hole and the externalenvironment.

In the light-emitting module 100, the light source 160 is disposed onthe lower surface 110 b of the light guide body 110, facing the firsthole 10 provided on the upper surface 110 a of the light guide body 110.In the example shown in FIG. 3, a second hole 20 is provided on thelower surface 110 b of the light guide body 110, and the light source160 is located inside the second hole 20 as viewed from above. Theoptical axis of the light source 160 substantially coincides with thecenter of the first hole 10, i.e., the light source 160 and the firsthole 10 are substantially concentric or coaxial.

As described above, the reflective resin layer 130 of eachlight-emitting module 100 is located in the first hole 10. In thisembodiment, the reflective resin layer 130 is located in the firstportion 11 of the first hole 10, which is closer to the light-emittingelement 120. In this example, the reflective resin layer 130 is formedin the first hole 10, occupying the entire first portion 11.

The reflective resin layer 130 is formed of a light reflective material.By locating the first hole 10 in the light guide body 110, facing thelight-emitting element 120, light emitted from the light-emittingelement 120 is allowed to be reflected on the side surfaces defining theshape of the first hole 10. In particular, in the embodiment of thepresent disclosure, the first hole 10 including the first portion 11having the first side surface 11 c and the second portion 12 having thesecond side surface 12 c is provided on the upper surface 110 a of thelight guide body 110. Therefore, by utilizing the first side surface 11c and the second side surface 12 c, which are sloped at different angleswith respect to the upper surface 110 a, as a reflective surface, lightemitted from the light-emitting element 120 is allowed to be moreefficiently diffused in the light guide body 110, particularly along theupper and lower surfaces 110 a and 110 b. Furthermore, the reflectiveresin layer 130 is disposed, facing the light-emitting element 120, andtherefore, the luminance of a portion of the upper surface 110 a of thelight guide body 110 that is located directly above the light-emittingelement 120 can be substantially prevented from being extremely higherthan the luminance of the other regions. Here, the reflective resinlayer 130 is formed selectively in the first portion 11 of the firsthole 10, and therefore, the luminance of such a portion located directlyabove the light-emitting element 120 can be substantially prevented frombeing unnecessarily reduced. As a result, more uniform light can beobtained while the overall thickness of the light-emitting module 100 isreduced.

The light guide body 110 has the second hole 20 that is located on thelower surface 110 b, facing the first hole 10. The second hole 20 has,for example, a truncated quadrilateral pyramidal shape. Typically, thecenter of the second hole 20 located on the lower surface 110 b of thelight guide body 110 substantially coincides with the center of thefirst hole 10 located on the upper surface 110 a of the light guide body110, i.e., the first and second holes 10 and 20 are substantiallyconcentric or coaxial.

The light source 160 includes the light-emitting element 120, awavelength conversion member 150, and a light reflective member 170. Thewavelength conversion member 150 is joined to a light emission surfaceof the light-emitting element 120, and the light reflective member 170is disposed on a side surface of the light-emitting element 120 and asurface of the light-emitting element 120 on the opposite side from thelight emission surface. The wavelength conversion member 150 is locatedat a bottom portion of the second hole 20 as viewed from the lowersurface 110 b, and therefore, light emitted from the light-emittingelement 120 is transmitted through the wavelength conversion member 150,and enters the light guide body 110, which has a light guide structure.A bonding member 190 is disposed in the second hole 20, covering sidesurfaces of the wavelength conversion member 150 and the lightreflective member 170.

The light-emitting module 100 further has an interconnection layer 180located on a lower surface 140 b of the light reflective member 140. Theinterconnection layer 180 is electrically coupled to an electrode of thelight-emitting element 120. The interconnection layer 180 is alsooptionally electrically coupled to electrodes of a plurality oflight-emitting elements 120 disposed in a unit region.

In this embodiment, the light source 160 includes a singlelight-emitting element. Alternatively, the light source 160 may includea plurality of light-emitting elements. The light source 160 typicallyemits white light. In this embodiment, the light-emitting element 120is, for example, a light-emitting diode that emits blue light, and apart of the emitted blue light is converted into yellow light by thewavelength conversion member 150. Blue light and yellow light emitted bythe light source 160 together form white light. Alternatively, the lightsource 160 may include, for example, three light-emitting elements thatemit light beams having red, blue, and green wavelengths, respectively,which together form white light.

For each constituent element used in the integrated light-emittingdevice 200, members and materials can be used that are commonly used toimplement light-emitting devices employing light-emitting diodes.

(Structure of Light Guide Body Aggregate Substrate)

Next, a structure of a light guide body aggregate substrate will bedescribed. FIGS. 4A and 4B are a top view and bottom view of a lightguide body aggregate substrate 301. FIG. 4C is a cross-sectional view ofthe light guide body aggregate substrate 301 taken along line 4C-4C ofFIG. 4A.

The light guide body aggregate substrate 301 includes: a substrate 300having a main surface 300 a and a back surface 300 b located on theopposite side from the main surface 300 a; and a plurality of unitregions 310, a marginal region 311, and a plurality of alignment marks,which are located on the main surface 300 a. The plurality of alignmentmarks are formed on the main surface 300 a.

The substrate 300 has light-transmitting properties. The light guidebodies 210 of the plurality of integrated light-emitting devices 200 areintegrally formed on the substrate 300. Specifically, a plurality ofunit regions 310 are disposed on the main surface 300 a of the substrate300 and are spaced apart from each other one- or two-dimensionally. Theplurality of unit regions 310 each serve as a light guide body 210 afterbeing separated by cutting. Each unit region 310 has a light guide bodystructure. Specifically, as described above, the main surface 300 a ineach unit region 310 is the upper surface 210 a of the light guide body210, and has the first hole 10. The back surface 300 b in each unitregion 310 is the lower surface 210 b of the light guide body 210, andhas the second hole 20. Light emitted from the light-emitting element120 disposed in the second hole 20 may be transmitted through the unitregion 310, and may then be emitted from the main surface 300 aincluding the first hole 10. Note that the correspondence between themain and back surfaces 300 a and 300 b of the substrate 300 and theupper and lower surfaces 210 a and 210 b of the light guide body 210 maybe reversed. Specifically, the main surface 300 a of the substrate 300may correspond to the lower surface 210 b of the light guide body 210,and the back surface 300 b of the substrate 300 may correspond to theupper surface 210 a of the light guide body 210. In that case, thesecond hole 20 is provided on the main surface 300 a of the substrate300, and the first hole 10 is provided on the back surface 300 b of thesubstrate 300. Thus, alignment marks to be described below are providedon either the upper surface 210 a or the lower surface 210 b of thelight guide body 210 of the integrated light-emitting device 200.

In this embodiment, the plurality of unit regions 310 are arranged in amatrix of a plurality of rows and a plurality of columns extending inthe X-axis direction (first direction) and the Y-axis direction (seconddirection), and are two-dimensionally spaced apart from each other.Alternatively, the plurality of unit regions 310 may be arranged in amatrix of one row extending in the X-axis direction (first direction)and a plurality of columns, and may be one-dimensionally spaced apartfrom each other. In that case, each column includes one unit region 310.In this embodiment, a plurality of unit regions 310 are arranged in amatrix of four rows and five columns. Specifically, five columns 310Ceach including four unit regions 310 arranged in the Y-axis directionare arranged in the X direction. In other words, four rows 310R eachincluding five unit regions 310 arranged in the X-axis direction arearranged in the Y direction.

As shown in FIG. 4B, when viewed from the back surface 300 b of thesubstrate 300, the plurality of unit regions 310 are arranged in amatrix of one or a plurality of rows and a plurality of columnsextending in the first and second directions, and are spaced apart fromeach other one- or two-dimensionally.

In the main surface 300 a and the back surface 300 b, the marginalregion 311 is disposed around each unit region 310. In other words, theunit regions 310 are spaced apart from each other with the marginalregion 311 interposed therebetween. As described below, the marginalregion 311 is a cutting margin for cutting the substrate 300 and thelight reflective layer 240 after the light-emitting element 120, thelight reflective layer 240, etc., have been joined to the substrate 300.

A plurality of alignment marks define the positions of the plurality ofunit regions 310 of the substrate 300. The light guide body aggregatesubstrate 301 may have a plurality of sets of alignment marks, dependingon the required processing precision, or the specification or processingprecision of a cutting apparatus for dicing. In this embodiment, thelight guide body aggregate substrate 301 includes a plurality of firstalignment marks 331, a plurality of second alignment marks 332, aplurality of third alignment marks 333, and a plurality of fourthalignment marks 334. The plurality of alignment marks are disposed inthe marginal region 311. The plurality of first alignment marks 331, theplurality of second alignment marks 332, the plurality of thirdalignment marks 333, and the plurality of fourth alignment marks 334 arealso collectively referred to as simply alignment marks 331-334.

The plurality of first alignment marks 331 are arranged in the X-axisdirection. Each first alignment mark 331 is disposed on the main surface300 a at a position corresponding to the position in the X-axisdirection of one of the columns 310C of the plurality of unit regions310. Specifically, the position in the X-axis direction of one of thecolumns 310C indicates the position in the X-axis direction of one of apair of sides parallel to the Y axis of the four sides of a rectangledefining the unit regions 310 included in that column 310C. In thisembodiment, a first alignment mark 331 is disposed at a positioncorresponding to a first end 310C1 including one of two sides extendingin the Y-axis direction that is closer to the origin, of the four sidesof the unit regions 310 of each column 310C. As used herein, the term“correspond” means that the position of a first alignment mark 331 isdetermined with respect to the first end 310C1 of each column 310C underthe same condition, and the first alignment mark 331 is disposed at thatposition. For example, the first alignment mark 331 may be disposed atthe same position on the X axis as that of the first end 310C1, or maybe disposed at a position a predetermined distance (e.g., 0.5 mm) awayfrom the first end 310C1.

In this embodiment, the light guide body aggregate substrate 301 has twosets of first alignment marks 331. The two sets are disposed in regions311T and 311B of the marginal region 311 that are located outside of theopposite ends in the Y direction of the columns 310C.

The plurality of second alignment marks 332 are arranged in the X-axisdirection. Each second alignment mark 332 is disposed on the mainsurface 300 a at a position corresponding to another position in theX-axis direction of one of the columns 310C of the plurality of unitregions 310. In this embodiment, a second alignment mark 332 is disposedat a position corresponding to a second end 310C2 including one of twosides extending in the Y-axis direction that is further from the origin,of the four sides of the unit regions 310 of each column 310C. In thisembodiment, the light guide body aggregate substrate 301 has two sets ofsecond alignment marks 332. The two sets are disposed in the regions311T and 311B of the marginal region 311 that are located outside of theopposite ends in the Y direction of the columns 310C.

In this embodiment, the first alignment marks 331 and the secondalignment marks 332 are disposed so as to form different rows in theY-axis direction. As a result, for example, even if the marginal region311 in the X direction of the plurality of unit regions 310 is so narrowthat the first alignment marks 331 and the second alignment marks 332cannot be disposed in a single row, the first alignment marks 331 andthe second alignment marks 332 can be provided. If the marginal region311 is wide, the first alignment marks 331 and the second alignmentmarks 332 may be disposed in a single row.

The plurality of third alignment marks 333 and the plurality of fourthalignment marks 334 are also disposed in a manner similar to that of thefirst alignment marks 331 and the second alignment marks 332, exceptthat the third alignment marks 333 and the fourth alignment marks 334are arranged in the Y-axis direction. Specifically, the plurality ofthird alignment marks 333 are arranged in the Y-axis direction. Eachthird alignment mark 333 is disposed on the main surface 300 a at aposition corresponding to the position in the Y-axis direction of one ofthe rows 310R of the plurality of unit regions 310. Specifically, theposition in the Y-axis direction of one of the rows 310R indicates theposition in the Y-axis direction of one of a pair of sides parallel tothe X axis of the four sides of a rectangle defining the unit regions310 included in that row 310R. In this embodiment, a third alignmentmark 333 is disposed at a position corresponding to a third end 310R3including one of two sides extending in the X-axis direction that iscloser to the origin, of the four sides of the unit regions 310 of eachrow 310R. The light guide body aggregate substrate 301 has two sets ofthird alignment marks 333. The two sets are disposed in regions 311R and311L of the marginal region 311 that are located outside of the oppositeends in the X direction of the rows 310R.

The plurality of fourth alignment marks 334 are arranged in the Y-axisdirection. Each fourth alignment mark 334 is disposed on the mainsurface 300 a at a position corresponding to another position in theY-axis direction of one of the rows 310R of the plurality of unitregions 310. In this embodiment, a fourth alignment mark 334 is disposedat a position corresponding to a fourth end 310R4 including one of twosides extending in the X-axis direction that is further from the origin,of the four sides of the unit regions 310 of each row 310R.

In this embodiment, the third alignment marks 333 and the fourthalignment marks 334 are disposed so as to form different columns in theX-axis direction. However, the third alignment marks 333 and the fourthalignment marks 334 may be disposed in a single column.

The alignment marks 331-334 are formed on the main surface 300 a in anoptically recognizable form. For example, the alignment marks 331-334may have a protruding shape that is protruded from the main surface 300a, or a recessed shape that is recessed from the main surface 300 a. Inthe case of the protruding shape, the strength of the light guide bodyaggregate substrate can be maintained. In the case of the recessedshape, the light guide body aggregate substrate can be easily held by asheet or the like. In both of the protruding and recessed shapes, if theside surface is sloped, a contrast difference emerges in imagerecognition using a device, and therefore, the alignment marks can bemore easily observed and recognized. In the case of the recessed shape,a slope is preferably formed so that the area of the bottom surface ofthe opening is smaller than the area of the upper surface of theopening. In the case of the protruding shape, a slope is preferablyformed so that the area of the upper surface of the frustum shape issmaller than the area of the bottom surface of the frustum shape. Inthese cases, the alignment marks 331-334 can be more easily formed. Thealignment marks 331-334 may have a surface roughness different from theother regions of the main surface 300 a. The alignment marks 331-334 mayhave a shape that is recognizable by the image recognition function of acutting device for use in dicing. In this embodiment, the alignmentmarks 331-334 are each formed by two rectangles and a spacetherebetween. The position of the space interposed between the tworectangles is a reference to each of the alignment marks 331-334.

The light guide body aggregate substrate 301 may be produced by formingthe light guide body structures of the unit regions 310 and thealignment marks 331-334 on the substrate 300 made of alight-transmitting material, such as a thermoplastic resin (e.g., anacryl, a polycarbonate, a cyclic polyolefin, polyethylene terephthalate,or a polyester), a thermosetting resin (e.g., an epoxy or a silicone),glass, or the like. For example, a mold having a shape corresponding tothe light guide body structures of the unit regions 310 and thealignment marks 331-334 may be used to perform injection molding or thelike so that the molding of the substrate 300 and the formation of thelight guide body structures of the unit regions 310 and the alignmentmarks 331-334 are simultaneously performed. Alternatively, the moldingof the substrate 300 and the formation of the light guide bodystructures of the unit regions 310 are firstly performed simultaneouslyby injection molding, and thereafter, the alignment marks 331-334 may beformed on the main surface 300 a by laser processing or the like. As amaterial for the substrate 300, polycarbonates are preferably usedbecause of their low cost and high transparency.

In the light guide body aggregate substrate 301, one of the plurality offirst alignment marks 331 is disposed at a position corresponding to theposition in the X-axis direction of one of the plurality of columns 310Cof unit regions 310. Therefore, when a thermal treatment is performed invarious steps of forming the light-emitting element 120, the lightreflective layer 240, etc., on the light guide body aggregate substrate301 to produce an aggregate of integrated light-emitting devices, thenif the positions of the unit regions 310 are shifted due to theexpansion and contraction of the substrate 300, the positions of theplurality of first alignment marks 331 are also similarly shifted.Therefore, by dicing the aggregate of integrated light-emitting deviceswith reference to the first alignment marks 331, the columns can beseparated while the influence of the expansion is reduced. In addition,the light guide body aggregate substrate 301 has the second alignmentmarks 332 arranged in the X-axis direction, and therefore, the shift ofthe positions of the opposite ends in the X-axis direction of eachcolumn due to the thermal expansion is reflected by the first alignmentmarks 331 and the second alignment marks 332, whereby the columns can beseparated while the influence of the expansion is further reduced.

Likewise, the light guide body aggregate substrate 301 has the thirdalignment marks 333 and the fourth alignment marks 334, and therefore,the shift of the opposite ends in the Y-axis direction of each row ofunit regions 310 due to the thermal expansion is reflected by the thirdalignment marks 333 and the fourth alignment marks 334, whereby the rowscan be separated from each other while the influence of the expansion inthe Y-axis direction is reduced. As a result, the aggregate ofintegrated light-emitting device can be cut into pieces while theinfluence of the thermal expansion is reduced in the two directions.Therefore, the center of each piece obtained by cutting can coincidewith the center of the light guide structure on the X-Y plane of eachintegrated light-emitting device, i.e., the piece and the light guidestructure can be concentric or coaxial. Furthermore, the alignment marks331-334 are disposed corresponding to the unit regions 310, andtherefore, even if the light guide body aggregate substrate 301 isnon-uniformly expanded, depending on the position, the center of eachpiece obtained by cutting can coincide with the center of the lightguide structure on the X-Y plane of each integrated light-emittingdevice obtained by cutting, i.e., the piece and the light guidestructure can be concentric or coaxial, by cutting the light guide bodyaggregate substrate 301 with reference to the alignment marks 331-334.

(Production Method for Integrated Light-Emitting Device)

An embodiment of a production method for the integrated light-emittingdevice of the present disclosure will be described. FIG. 5 is aflowchart showing steps in the production method for the integratedlight-emitting device. The production method for the integratedlight-emitting device includes (1) a step of preparing a light guidebody aggregate substrate, (2) a step of disposing a plurality of lightsources on the light guide body aggregate substrate, and (3) a step ofcutting the substrate. Each step will now be described in detail.

(1) Step of Preparing Light Guide Body Aggregate Substrate (S1)

Initially, a light guide body aggregate substrate 301 is prepared. Forexample, a light guide body aggregate substrate 301 having the shapeshown in FIGS. 4A-4C is prepared. As described above, the light guidebody aggregate substrate 301 in which the alignment marks 331-334 areformed on the main surface 300 a of the substrate 300 and the unitregions 310 are two-dimensionally arranged on the substrate 300 isproduced by injection molding or the like using a mold having a shapecorresponding to the light guide body structure including the firstholes 10 and the second holes 20 of the unit regions 310, and thealignment marks 331-334.

(2) Step of Disposing Plurality of Light Sources on Light Guide BodyAggregate Substrate (S2)

The light sources 160 are disposed on the light guide body aggregatesubstrate 301. Initially, the light sources 160 are produced. Forexample, a plurality of light-emitting elements 120 aretwo-dimensionally arranged and bonded using a light-transmitting bondingmember or the like that serves as the plate-shaped wavelength conversionmember 150. Thereafter, the light reflective member 170 is disposed onthe wavelength conversion member 150 so as to cover the side surfaces ofthe light-emitting elements 120. The wavelength conversion member 150and the light reflective member 170 are cut into pieces each including alight-emitting element 120. Thus, the light sources 160 are produced.

Next, an uncured bonding member is disposed in the second holes 20located on the back surface 300 b of the light guide body aggregatesubstrate 301, and the light sources 160 are disposed in the secondholes 20. As a result, the bottoms of the second holes 20 face thewavelength conversion members 150, and the uncured bonding member coversthe side surfaces of the wavelength conversion members 150 and the lightreflective members 170, which are the side surfaces of the light sources160. Thereafter, the uncured bonding member is cured by applying energy,such as light, heat, ultraviolet light, or the like, thereto. As aresult, the light sources 160 are disposed in the unit regions 310 sothat light emitted from the light-emitting elements 120 enter the unitregions 310.

Thereafter, an uncured light reflective member is disposed on the backsurface 300 b. In addition, an uncured reflective resin layer isdisposed in the first portions 11 of the first holes 10 on the mainsurface 300 a. Next, these uncured light reflective members are curd byapplying energy, such as light, heat, ultraviolet light, or the like,thereto. As a result, the light reflective members 140 are formed on theback surface 300 b. In addition, the reflective resin layer 130 isdisposed in the first holes 10. Furthermore, the interconnection layer180 that is electrically coupled to the light-emitting elements 120 isformed on the lower surfaces 140 b of the light reflective members 140.As a result, a composite substrate is completed in which an integratedlight-emitting device is formed in each unit region 310.

Note that, in the case in which the main surface 300 a corresponds tothe upper surfaces 210 a of the light guide bodies 210, and in the nextstep (S3) of cutting the substrate, the light guide body aggregatesubstrate 301 is introduced into a substrate cutting apparatus with theback surface 300 b facing up, it is preferable that the light reflectivemembers 140 should not be formed in the marginal region 311 in which thealignment marks 331-334 are provided. In addition, in the case in whichthe main surface 300 a corresponds to the lower surfaces 210 b of thelight guide bodies 210, and in the next step (S3) of cutting thesubstrate, the light guide body aggregate substrate 301 is introducedinto a substrate cutting apparatus with the main surface 300 a facingup, it is preferable that the light reflective members 140 should not beformed in the marginal region 311 in which the alignment marks 331-334are provided.

In some of the above steps, the light guide body aggregate substrate 301is subjected to a thermal treatment, which may cause the light guidebody aggregate substrate 301 to expand or contract. In such a case, theunit regions 310 and the alignment marks 331-334 on the light guide bodyaggregate substrate 301 are moved together due to the expansion orcontraction. Therefore, even if the expansion or contraction occurs, thealignment marks 331-334 are still located at positions corresponding tothe first ends 310C1, second ends 310C2, third ends 310R3, and fourthends 310R4 corresponding to the columns or rows of the unit regions 310.

(3) Step of Cleaving Substrate (S3)

Next, the light guide body aggregate substrate 301 (composite substrate)on which a plurality of integrated light-emitting devices are formed iscut into pieces, i.e., diced. The light guide body aggregate substrate301 can be cut using a substrate cutting (separation) apparatus for asemiconductor substrate, resin substrate, etc., that is used in aproduction process of a semiconductor device. The cutting apparatus maybe equipped with a rotary blade or linear blade.

Initially, the back surface 300 b of the light guide body aggregatesubstrate 301 on which a plurality of integrated light-emitting devicesare formed is supported using a technique suitable for the substratecutting apparatus, such as vacuum suctioning or use of an adhesivesheet, so as to prevent the integrated light-emitting devices 200 frombeing moved after dicing. For example, the light guide body aggregatesubstrate 301 on which a plurality of integrated light-emitting devicesare formed is disposed on a stage of the substrate cutting apparatuswith the main surface 300 a facing up. Alternatively, the light guidebody aggregate substrate 301 on which a plurality of integratedlight-emitting devices are formed is disposed on a stage of thesubstrate cutting apparatus with the back surface 300 b facing up. Inthat case, as described above, it is preferable that the lightreflective member 140 should not be formed, so that the alignment marks331-334 can be detected by image recognition from the back surface 300b.

An image of the main surface 300 a of the light guide body aggregatesubstrate 301 disposed on the stage is captured using an imagingapparatus for the integrated light-emitting devices, and the positionsof the alignment marks 331-334 in the captured image are obtained byimage recognition. The stage is optionally turned, depending on thepositions of the alignment marks 331-334, so that the cutting directionis parallel to the Y axis of the light guide body aggregate substrate301. In this embodiment, the light guide body aggregate substrate 301has two sets of each of the first alignment marks 331, second alignmentmarks 332, third alignment marks 333, and fourth alignment marks 334.Therefore, a straight line connecting alignment marks located at theopposite ends of each column or row may be determined as the X axis andY axis of the light guide body aggregate substrate 301. In the case inwhich the light guide body aggregate substrate 301 has a single set ofeach of the alignment marks 331-334, the X axis and Y axis of the lightguide body aggregate substrate 301 may be determined based on thearrangement direction of each of the alignment marks 331-334.

As shown in FIG. 6, the light guide body aggregate substrate 301 and thelight reflective layer 240 are cut in the Y-axis direction, withreference to the position of each of the plurality of first alignmentmarks 331, in the marginal region between a corresponding pair ofadjacent ones of the plurality of columns 310C of the plurality of unitregions 310. In this embodiment, the light guide body aggregatesubstrate 301 also has the plurality of second alignment marks 332. Thelight guide body aggregate substrate 301 and the light reflective layer240 are also cut in the Y-axis direction, with reference to the positionof each of the plurality of second alignment marks 332, in the marginalregion between a corresponding pair of adjacent ones of the plurality ofcolumns 310C of the plurality of unit regions 310. As a result, thelight guide body aggregate substrate 301 and the light reflective layer240 are cut in the Y-axis direction at or near the positions of thefirst ends 310C1 and the second ends 310C2 in the X direction of thecolumns 310C of the unit regions 310.

Next, the stage is turned by 90 degrees. Thereafter, the light guidebody aggregate substrate 301 and the light reflective layer 240 are cutin the X-axis direction, with reference to the position of each of theplurality of third alignment marks 333, in the marginal region between acorresponding pair of adjacent ones of the plurality of rows 310R of theplurality of unit regions 310. In this embodiment, the light guide bodyaggregate substrate 301 also has the plurality of fourth alignment marks334. The light guide body aggregate substrate 301 and the lightreflective layer 240 are also cut in the X-axis direction, withreference to the position of each of the plurality of fourth alignmentmarks 334, in the marginal region between a corresponding pair ofadjacent ones of the plurality of rows 310R of the plurality of unitregions 310. As a result, the light guide body aggregate substrate 301and the light reflective layer 240 are cut in the X-axis direction at ornear the positions of the third ends 310R3 and the fourth ends 310R4 inthe Y direction of the rows 310R of the unit regions 310. As a result,the light guide body aggregate substrate 301 are cut into pieces, i.e.,a plurality of integrated light-emitting devices 200 are obtained.

According to the production method for the integrated light-emittingdevice of the present disclosure, as described above, even when thelight guide body aggregate substrate 301 has expanded or contracted dueto a thermal treatment in the step of disposing a plurality of lightsources on the light guide body aggregate substrate, the positions ofthe alignment marks 331-334 on the light guide body aggregate substrate301 correspond to the positions of the first ends 310C1, second ends310C2, third ends 310R3, and fourth ends 310R4 of the columns or rows ofthe unit regions 310. Therefore, by determining the cutting positionswith reference to the alignment marks 331-334, the light guide bodyaggregate substrate 301 can be cut into pieces while the influence ofthe expansion is reduced.

OTHER EMBODIMENTS

Various modifications and changes can be made to the light guide bodyaggregate substrate and production method for an integratedlight-emitting device of the present disclosure. For example, on thelight guide body aggregate substrate 301, the first alignment marks 331,second alignment marks 332, third alignment marks 333, and fourthalignment marks 334 are disposed at positions corresponding to thepositions of the first ends 310C1, second ends 310C2, third ends 310R3,and fourth ends 310R4, respectively. However, an alignment mark may bedisposed at a position corresponding to the positions of two ends. Forexample, as shown in FIG. 7, a light guide body aggregate substrate 302may have a plurality of first alignment marks 331′ and a plurality ofthird alignment marks 333′ instead of the first alignment marks 331,second alignment marks 332, third alignment marks 333, and fourthalignment marks 334.

The plurality of first alignment marks 331′ are arranged in the X-axisdirection, and each of the plurality of first alignment marks 331′ isdisposed at a position corresponding to a center between the first end310C1 and second end 310C2 in the X-axis direction of the correspondingcolumn. Likewise, the plurality of third alignment marks 333′ arearranged in the Y-axis direction, and each of the plurality of thirdalignment marks 333′ is disposed at a position corresponding to theposition of a center between the third end 310R3 and fourth end 310R4 inthe Y-axis direction of the corresponding row.

While the light guide body aggregate substrate 301 expands or contractsdue to a thermal treatment, the space between two points that areseparated a relatively short distance from each other on the light guidebody aggregate substrate 301 expands or contracts in a small amount.Therefore, the amount of expansion or contraction may be negligiblebetween the first end 310C1 and the second end 310C2 in the X-axisdirection of each column 310C of unit regions 310, and between the thirdend 310R3 and the fourth end 310R4 in the Y-axis direction of eachcolumn 310C of unit regions 310. In that case, even when the position inthe X-axis direction of each column 310C and the position in the Y-axisdirection of each row 310R are each determined with reference to theposition of a single kind of alignment mark, the influence of expansionand contraction can be sufficiently reduced. In the case of a singlekind of alignment mark, for example, a single rectangle may be formedand an end of the rectangle may be utilized, instead of the spacebetween the two rectangles, so that the influence of expansion andcontraction can be sufficiently reduced. In the case in which such asingle rectangle is used, the cutting position of the substrate cuttingapparatus can be easily corrected. In addition, by disposing thealignment mark at the center of the unit region, the unit region can beprovided with reference to the center of the light-emitting unit.

In the case in which integrated light-emitting devices are producedusing the light guide body aggregate substrate 302, in the step (S3) ofcutting the substrate the designed position where each of the columns310C of the plurality of unit regions 310 is cut is adjusted using theposition of each of the plurality of first alignment marks 331′, and thelight guide body aggregate substrate 302 is cut in the Y-axis directionat the adjusted positions.

After the stage is turned by 90 degrees, the designed position whereeach of the rows 310R of the plurality of unit regions 310 is cut isadjusted using the position of each of the plurality of third alignmentmarks 333′, and the light guide body aggregate substrate 302 is cut inthe X-axis direction at the adjusted positions.

In the case in which integrated light-emitting devices are producedusing the light guide body aggregate substrate 302, the light guide bodyaggregate substrate 302 can be cut into pieces while the influence ofthe expansion of the light guide body aggregate substrate 302 isreduced.

As described above, the influence of expansion or contraction due to athermal treatment performed on the light guide body aggregate substrateincreases with an increase in the distance between two points. Inaddition, the degree of expansion or contraction may vary depending onthe shape of the light guide body 110, the method of molding the lightreflective member 140 located on the lower surface 110 b of light guidebody, or the like. Therefore, for example, in the case in which theplurality of unit regions 310 are disposed two-dimensionally in theX-axis and Y-axis directions on the light guide body aggregatesubstrate, alignment marks may not be formed in a direction that theinfluence of expansion or contraction is small. FIG. 8 shows a lightguide body aggregate substrate 303 that is different from the lightguide body aggregate substrate 301 in that the light guide bodyaggregate substrate 303 does not have the third or fourth alignmentmarks, and in which the number of unit regions 310 disposed in theY-axis direction is two. FIG. 9 shows a light guide body aggregatesubstrate 304 that is different from the light guide body aggregatesubstrate 302 in that the light guide body aggregate substrate 304 doesnot have the third alignment marks, and in which the number of unitregions 310 disposed in the Y-axis direction is two.

In that case, the rows 310R are separated by cutting in the X-axisdirection at, for example, the center in the Y-axis direction of thelight guide body aggregate substrate 303, 304, and at positions thewidth W in the Y-axis direction of the unit region 310 positively andnegatively away from that center.

In addition to the alignment marks, other structures may be provided onthe substrate 300 of the light guide body aggregate substrate. Forexample, FIGS. 10A-10C show a light guide body aggregate substrate 305that further includes ribs 341 and 342 on the substrate 300. The ribs341 and 342 are preferably disposed on one of the main surface 300 a andback surface 300 b of the substrate 300 of which the light reflectivemember 140 is provided, i.e., the second holes 20 are provided. In theexample shown in FIGS. 10A-10C, in the light guide body aggregatesubstrate 305, the plurality of second holes 20 are disposed on the backsurface 300 b of the substrate 300. Therefore, the ribs 341 and 342 arealso disposed on the back surface 300 b.

In FIG. 10B, specifically, the ribs 341 and 342 are disposed in regions311T and 311B, respectively, of the marginal region 311 that are locatedoutside of the opposite ends in the Y-axis direction of the columns 310Cof the plurality of unit regions 310. In the case in which the alignmentmarks 331 and 332 can be detected by image recognition, the alignmentmarks 331 and 332 and the ribs 341 and 342 may overlap in the Z-axisdirection. In the case in which the alignment marks 331 and 332 and theribs 341 and 342 do not overlap in the Z-axis direction, the ribs 341and 342 may be located between the alignment marks 331 and 332 and thecolumns 310C as viewed in the Z-axis direction, or may be locatedoutside of the alignment marks 331 and 332. The ribs 341 and 342protrude in the X-axis direction, and the height in the Z-axis directionthereof is substantially equal to the thickness of the light reflectivemember 140 formed on the back surface 300 b, for example.

For example, the ribs 341 and 342 blocks the uncured light reflectivemember disposed on the back surface 300 b of the substrate 300, whichwould otherwise spread during formation of the light reflective member140. The ribs 341 and 342 are also used in order to adjust the thicknessof the uncured light reflective member disposed, or adjust the thicknessof the cured light reflective member, with reference to the height ofthe ribs 341 and 342.

Note that in the light guide body aggregate substrate 305 of FIGS.10A-10C, the ribs 341 and 342 are disposed in the regions 311T and 3113located outside of the opposite ends in the Y direction of the columns310C of the plurality of unit regions 310. However, a pair of ribsextending in the Y-axis direction may be disposed in regions 311L and311R located outside of the opposite ends in the X-axis direction of therows 310R of the plurality of unit regions 310.

Embodiments of the present disclosure are useful for various types oflight sources for lighting, in-vehicle light sources, light sources fordisplays, etc. In particular, embodiments of the present disclosure areadvantageously applicable to backlight units for liquid-crystal displaydevices. A light-emitting module or surface-emission light sourceaccording to an embodiment of the present disclosure can be suitablyused in a backlight for the display devices of mobile devices, whichheavily require a reduction in thickness, surface-emission devices onwhich local dimming control can be performed, etc.

While exemplary embodiments of the present invention have been describedabove, it will be apparent to those skilled in the art that thedisclosed invention may be modified in numerous ways and may assume manyembodiments other than those specifically described above. Accordingly,it is intended by the appended claims to cover all modifications of theinvention that fall within the true spirit and scope of the invention.

What is claimed is:
 1. A light guide body aggregate substratecomprising: a light-transmitting substrate having a main surface; aplurality of unit regions located at the main surface of the substrate,wherein the plurality of unit regions are spaced apart from each other,wherein the plurality of unit regions are arranged one-dimensionally inone row extending in a first direction and a plurality of columns, orarranged two-dimensionally in a plurality of rows extending in the firstdirection and a plurality of columns extending in a second direction,and wherein a light guide structure is located in each unit region; afirst region located at the main surface of the substrate, surroundingthe plurality of unit regions; and a 1-A alignment mark and a 1-Balignment mark arranged at the substrate in the first region.
 2. Thelight guide body aggregate substrate according to claim 1, wherein: the1-A alignment mark and the 1-B alignment mark are arranged in the firstdirection.
 3. The light guide body aggregate substrate according toclaim 2, further comprising a 1-C alignment arranged at the substrate inthe first region, wherein: the 1-A alignment mark and the 1-C alignmentmark are arranged in the second direction.
 4. The light guide bodyaggregate substrate according to claim 1, further comprising a pluralityof first holes each located at respective one of the plurality of unitregions of the substrate, each first hole having an opening on the mainsurface of the substrate.
 5. The light guide body aggregate substrateaccording to claim 4, wherein each of the plurality of first holes has afirst side surface sloped with respect to the main surface of thesubstrate and a second side surface sloped with respect to the mainsurface of the substrate.
 6. The light guide body aggregate substrateaccording to claim 5, wherein a magnitude of a slope of the first sidesurface with respect to the main surface is different from a magnitudeof a slope of the second side surface with respect to the main surface.7. The light guide body aggregate substrate according to claim 2,further comprising a plurality of first holes each located at respectiveone of the plurality of unit regions of the substrate, each first holehaving an opening on the main surface of the substrate.
 8. A method forproducing an integrated light-emitting device, the method comprising:preparing the light guide body aggregate substrate, the light guide bodyaggregate substrate comprising: a light-transmitting substrate having amain surface, a plurality of unit regions located at the main surface ofthe substrate, wherein the plurality of unit regions are spaced apartfrom each other, wherein the plurality of unit regions are arrangedone-dimensionally in one row extending in a first direction and aplurality of columns, or arranged two-dimensionally in a plurality ofrows extending in the first direction and a plurality of columnsextending in a second direction, and wherein a light guide structure islocated in each unit region, a first region located at the main surfaceof the substrate, surrounding the plurality of unit regions, and a 1-Aalignment mark and a 1-B alignment mark arranged at the substrate in thefirst region; disposing a plurality of light sources on the light guidebody aggregate substrate, wherein each light source comprises one ormore light-emitting elements, and each light source being disposed for acorresponding one of the plurality of unit regions so that light emittedfrom the one or more light-emitting elements enters the light guidestructure; obtaining a position of the 1-A alignment mark and the 1-Balignment mark, respectively; and adjusting a position at which thesubstrate is to be cut, using the position of the 1-A alignment mark andthe 1-B alignment mark, and cutting the substrate at the adjustedposition.
 9. The method according to claim 8, wherein the in theadjusting and cutting step, the substrate is cut in the seconddirection.
 10. The method according to claim 8, wherein the 1-Aalignment mark and the 1-B alignment mark are arranged in the firstdirection.
 11. The method according to claim 10, wherein the light guidebody aggregate substrate further comprises a 1-C alignment arranged atthe substrate in the first region, and the 1-A alignment mark and the1-C alignment mark are arranged in the second direction.
 12. The methodaccording to claim 8, wherein the light guide body aggregate furthercomprising a plurality of first holes each located at respective one ofthe plurality of unit regions of the substrate, each first hole havingan opening on the main surface of the substrate.
 13. The methodaccording to claim 12, further comprising the steps of disposing areflective resin layer in the each of the plurality of first holes. 14.The method according to claim 12, wherein each of the plurality of firstholes has a first side surface sloped with respect to the main surfaceof the substrate and a second side surface sloped with respect to themain surface of the substrate.
 15. The method according to claim 14,wherein a magnitude of a slope of the first side surface with respect tothe main surface is different from a magnitude of a slope of the secondside surface with respect to the main surface.
 16. The method accordingto claim 9, wherein the 1-A alignment mark and the 1-B alignment markare arranged in the first direction.
 17. The method according to claim16, wherein the light guide body aggregate further comprising aplurality of first holes each located at respective one of the pluralityof unit regions of the substrate, each first hole having an opening onthe main surface of the substrate.
 18. The method according to claim 17,further comprising the steps of disposing a reflective resin layer inthe each of the plurality of first holes.
 19. The method according toclaim 18, wherein each of the plurality of first holes has a first sidesurface sloped with respect to the main surface of the substrate and asecond side surface sloped with respect to the main surface of thesubstrate.
 20. The method according to claim 19, wherein a magnitude ofa slope of the first side surface with respect to the main surface isdifferent from a magnitude of a slope of the second side surface withrespect to the main surface.